Fujitsu Develops World's First Technologies Enabling Formation and Multi-layering of High Dielectric Constant Ceramic Film&nbs

Tokyo, August 6, 2004 — Fujitsu Limited and Fujitsu Laboratories Ltd., in collaboration with the National Institute of Advanced Industrial Science and Technology (AIST) of Japan, today announced that they have jointly developed the world's first technologies that enable the formation and multi-layering at room temperature of ceramic film with dielectric constant(1) of 400, on resin circuit boards. The new technologies makes it possible to embed passive components such as condensers into printed circuit boards, such as FR4(2), thereby achieving miniaturization and cost reductions of circuit boards.

The technologies were developed as part of basic research to realize further miniaturization of devices for the ubiquitous networking era, by integrating resin with ceramic materials. Details of the new technology will be presented at the International Conference on Crystal Growth (ICCG) to be held from August 9 in Grenoble, France. Research for the new technology was commissioned by the New Energy and Industrial Technology Development Organization (NEDO), as part of the Nano Structure Forming for Advanced Ceramic Integration Technology Project, a nano-technology program of Japan’s Ministry of Economy, Trade, and Industry.